Semiconductor Packaging News2m
Global wafer foundry industry to see over 10% CAGR in revenues from 2024-2029, says DIGITIMES Research
Global wafer foundry industry to see over 10% CAGR in revenues from 2024-2029, says DIGITIMES Research: Summary The global wafer foundry market will grow 11.5% annually, reaching ...
Semiconductor Packaging News2m
Global notebook shipments rise in 3Q24 before decline in 4Q24, says DIGITIMES Research
Global notebook shipments rise in 3Q24 before decline in 4Q24, says DIGITIMES Research: Summary Global notebook shipments grew 5.8% in Q3 2024, driven by gaming, AI, and MacBooks, ...
Semiconductor Packaging News2m
Research Bits: Nov. 25
Summary Lawrence Livermore researchers developed a 3D-printable silicone foam combining mechanical and ESD protection for electronics packaging. Using carb ...
Semiconductor Packaging News9m
TSMC to push US to No. 2 in IC production in 2027
TSMC's $65 billion investment in Arizona aims to boost the U.S. share of advanced semiconductor production from 9% to 21% by 2027, according to TrendForce. Taiwan will remain the leader, but its share ...
Semiconductor Packaging News16h
Electromigration Performance Of Fine-Line Cu RDL For HDFO Packaging
The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance ...
Semiconductor Packaging News3d
Renesas Introduces Industry's First Complete Memory Interface Chipset Solutions
Renesas Electronics Corporation announced that it has delivered the industry's first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity ...
Semiconductor Packaging News3d
Flexible, space-saving class-D amplifier for in-car audio adds automotive-optimized diagnostics
The HFA80A automotive-grade analog-input class-D audio amplifier combines high efficiency, small size, and a low bill of materials, with load diagnostics optimized for automotive ... ST has introduced ...
Semiconductor Packaging News5d
Littelfuse Expands NanoT IP67-Rated Tactile Switch Series with New Top- and Side-Actuated Options
Littelfuse, Inc. announced the extension of its ITV2718 surface-mountable Li-ion battery protector series. These fuses safeguard Li-ion battery packs against overcurrent ... Littelfuse, Inc. is ...
Semiconductor Packaging News3d
StratEdge Wins Prestigious IMAPS 2024 Corporate Recognition Award
StratEdge Corporation is proud to announce that it has been awarded the 2024 IMAPS Corporate Recognition Award. The prestigious award was presented on October 1, 2024 ... StratEdge Corporation has ...
Semiconductor Packaging News23h
Huawei aims to mass-produce newest AI chip
Summary Huawei plans to mass-produce its advanced AI chip, the Ascend 910C, in early 2024 despite US restrictions limiting production capacity. With yields below commercial viability and supply delays ...
Semiconductor Packaging News6d
Lightmatter and Amkor Partner to Build World's Largest 3D Photonics Package
Lightmatter announced a strategic partnership with Amkor Technology to create the largest-ever 3D-packaged chip complex utilizing Lightmatter's innovative Passage™ platform. ... We search for industry ...
Semiconductor Packaging News19d
Standard-threshold 40V MOSFETs in enhanced STripFET F8 technology released
ST has introduced 40V STripFET F8 MOSFETs with standard threshold voltage (VGS(th)), combining the advantages of the enhanced trench gate technology with superior noise ... ST has introduced an ...